Installation structure of electronic component for tire

ABSTRACT

An installation structure of an electronic component for a tire, where the installation structure protects the electronic component from heat produced by a tire and a braking device and enables accurate information about the inside of the tire to be obtained without being affected by the heat sources. In the installation structure, an electronic component housed in a case is installed at an arbitrary installation in the air chamber of a tire and a heat-insulating structure is interposed between the electronic components and the installation position.

TECHNICAL FIELD

The present invention relates to a structure where an electroniccomponent for detecting information about the inside of a tire, such asan internal pressure and a temperature, is installed at an arbitraryinstallation position in an air chamber of the tire. More particularly,the present invention relates to an installation structure of anelectronic component for a tire, where the installation structureprotects the electronic component from heat produced by the tire and abraking device and enables accurate information about the inside of thetire to be obtained without being affected by the heat sources.

BACKGROUND ART

In order to monitor information about the inside of a tire, such as aninternal pressure and a temperature, there has been heretofore performedinstallation of various electronic components in an air chamber of thetire. These electronic components are generally attached to an innersurface of the tire or an outer peripheral surface of a rim, or buriedin the inside of the tire (for example, see Japanese patent applicationKokai publication Nos. Hei 11(1999)-278021 and 2000-168322).

However, if an electronic component for detecting information about theinside of a tire is installed in a state where the electronic componentadheres closely to the tire or a wheel, heat produced by the tire and abraking device is easily transmitted to the electronic component, andaccordingly, it is difficult to use electronic components having a lowheat resistance. Moreover, in detection of an air pressure, normally, apressure sensor measures an internal pressure of the tire. Meanwhile, atemperature sensor measures a temperature in an air chamber of the tire,and the internal pressure of the tire is corrected based on thetemperature. However, if the temperature sensor is affected by the heatproduced by the tire and the braking device, there is not only a problemthat an accurate temperature cannot be obtained but also a problem thatthe internal pressure of the tire, which is corrected based on thetemperature, also becomes inaccurate.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide an installationstructure of an electronic component for a tire, where the installationstructure protects the electronic component from heat produced by thetire and a braking device and enables accurate information about theinside of the tire to be obtained without being affected by the heatsources.

An installation structure of an electronic component for a tire of thepresent invention to achieve the foregoing object is a structure wherean electronic component housed in a case is installed at an arbitraryinstallation position in an air chamber of the tire, characterized inthat a heat-insulating structure is interposed between the electroniccomponent and the installation position.

Specifically, the installation structure of an electronic component fora tire of the present invention is a structure where an electroniccomponent housed in a case is installed at an arbitrary installationposition in an air chamber of the tire, characterized in that aheat-insulating structure is interposed between the case and theinstallation position.

More specifically, the installation structure of an electronic componentfor a tire of the present invention is a structure where an electroniccomponent housed in a case is installed at an arbitrary installationposition in an air chamber of the tire, characterized in that a pedestalincluding a base plate part which comes into contact with theinstallation position, and supporting parts which support the case isused; that the base plate part of the pedestal is attached to theinstallation position; that the case is fixed to the supporting parts ofthe pedestal; and that a heat-insulating structure is interposed betweenthe case and the base plate part of the pedestal.

As described above, by interposing the heat-insulating structure betweenthe electronic component installed in the air chamber of the tire andthe installation position, the electronic component is protected fromthe heat produced by the tire and the braking device. At the same time,more accurate information about the inside of the tire can be obtainedwithout being affected by the heat sources.

As the heat-insulating structure described above, a heat-insulatingspace or a heat-insulating material can be interposed. If theheat-insulating space is interposed, the heat-insulating space may be anopen space or may be a closed space where a pressure is reducedapproximately to a vacuum state. If the heat-insulating material isinterposed, it is preferable that the heat-insulating material is formedof resin foam such as open-cell sponge and foamed plastic, organicfibers or inorganic fibers. Particularly, an organic high-temperatureheat-insulating material using harmless organic fibers withhigh-temperature resistance, such as poly-paraphenylene benzobisoxazole(PBO), is preferable.

In the above-described installation structure of an electronic componentfor a tire, since the heat produced by the heat sources such as the tireand the braking device is easily transmitted to the pedestal whichsupports the case of the electronic component, it is preferable that thepedestal is formed of resin of which continuous duty is allowed attemperatures of no less than 80° C. When such a pedestal is used, it ispreferable that a patch which can be bonded to the installation positionof the electronic component is integrated with the pedestal. Moreover,it is preferable that through holes are provided in the patch atpositions corresponding to the supporting parts of the pedestal and thepedestal is held by the patch while inserting the supporting parts intothe through holes. According to the structure described above, anoperation of installing the pedestal is facilitated.

In the present invention, an arbitrary installation position in the airchamber of the tire means any position in an inner surface of apneumatic tire or an outer peripheral surface of a rim of a wheel, theposition being suitable in installation of the electronic component. Forexample, an inner surface of a bead part of the pneumatic tire, an innersurface of a tread part of the pneumatic tire, an outer peripheralsurface of a rim in a well part of the wheel, or the like is suitable.Further, an electronic component means a pressure sensor, a temperaturesensor, a transmitter, a receiver, a control circuit, a battery or thelike. These electronic components are usually housed in a case andunitized.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view schematically showing an example of aninstallation structure of an electronic component for a tire of thepresent invention.

FIG. 2 is a sectional view schematically showing another example of theinstallation structure of an electronic component for a tire of thepresent invention.

FIG. 3 is a plan view showing an installation structure of an electroniccomponent for a tire according to a preferred embodiment of the presentinvention.

FIG. 4 is a side view showing the installation structure of anelectronic component for a tire according to the preferred embodiment ofthe present invention.

FIG. 5 is a sectional view along the line X-X indicated by the arrows inFIG. 3.

FIG. 6 is a perspective view showing a pedestal used in the presentinvention.

FIG. 7 is a perspective view showing a patch used in the presentinvention.

FIG. 8 is a plan view showing an assembly of the pedestal, the patch andbinding bands, the assembly used in the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

With reference to the accompanying drawings, a configuration of thepresent invention will be described in detail below.

FIGS. 1 and 2 both schematically show an installation structure of anelectronic component for a tire of the present invention. As shown inFIGS. 1 and 2, the installation structure of an electronic component fora tire of the present invention is a structure where an electroniccomponent 2 housed in a case 1 is installed at an arbitrary installationposition P in an air chamber of the tire.

In FIG. 1, a pedestal 3, which includes a base plate part 3 a cominginto contact with the installation position P, and a supporting part 3 bsupporting the case 1, is used. The base plate part 3 a of the pedestal3 is mounted on the installation position P, and the case 1 is fixed tothe supporting part 3 b of the pedestal 3. Accordingly, aheat-insulating structure formed of a heat-insulating space 4 isinterposed between the case 1 and the base plate part 3 a of thepedestal 3. Meanwhile, in FIG. 2, a heat-insulating structure formed ofa heat-insulating material 5 is interposed between the case 1 and thebase plate part 3 a of the pedestal 3. Specifically, there is formed astructure where the electronic component 2 easily affected by heat isspaced from the installation position P with the heat-insulatingstructure interposed therebetween.

Here, the heat-insulating structure formed of the heat-insulating space4 or the heat-insulating material 5 may be provided in the case 1 aslong as the heat-insulating structure is positioned between theelectronic component 2 and the installation position P. Moreover, thepedestal 3 does not necessarily have to be used as long as theheat-insulating structure formed of the heat-insulating space 4 or theheat-insulating material 5 is structured so as to interpose theheat-insulating structure between the electronic component 2 and theinstallation position P.

FIGS. 3 to 5 show an installation structure of an electronic componentfor a tire according to a preferred embodiment of the present invention.FIG. 6 shows a pedestal, FIG. 7 shows a patch, and FIG. 8 shows anassembly of the pedestal, the patch and binding bands.

As shown in FIGS. 3 to 5, the installation structure of an electroniccomponent for a tire is a structure where an electronic component 2housed in a case 1 is installed at an arbitrary installation position Pin an air chamber of the tire. Here, in installation of the electroniccomponent 2, a pedestal 3, binding bands 6 and a patch 7 are used.

As shown in FIG. 6, the pedestal 3 is formed by integrally molding abase plate part 3 a, which comes into contact with an installationposition P, and a plurality of supporting parts 3 b which support thecase 1. The supporting parts 3 b are bent from the base plate part 3 aand have holes 3 c for inserting the binding bands 6, the holes beingformed in center portions in a height direction of the supporting parts3 b. Since heat produced by heat sources such as the tire and a brakingdevice is easily transmitted to the pedestal 3 and the binding bands 6,the pedestal 3 and the binding bands 6 may be formed of resin of whichcontinuous duty is allowed at temperatures of no less than 80° C., inconsideration of a operating environment thereof.

The resin of which continuous duty is allowed at temperatures of no lessthan 80° C. is generally called engineering plastics. Specifically,nylon, 66 nylon, polyethylene [ultra high molecular weight polyethylene(UHMWPE)], polybenzimidazole (PBI), polytetrafluoroethylene (PTFE),polyphenylene sulfide (PPS), polyimide, polyacetal, polyether imide,polyimide amide, polyvinylidene fluoride, polyamide,polyetheretherketone (PEEK), polyethylene terephthalate (PET), acetalcopolymer, polybutylene terephthalate (PBT), and the like can be cited.Particularly, 66 nylon is preferable.

As shown in FIG. 7, the patch 7 includes through holes 7 a at positionscorresponding to each one of the supporting parts 3 b of the pedestal 3.As the patch 7, for example, one obtained by processing acommercially-available patch for repairing a tire can be used. A backside of the patch 7 has a surface that can be bonded to the installationposition P.

The pedestal 3, the binding bands 6 and the patch 7, which are describedabove, are assembled as shown in FIG. 8, prior to installation of theelectronic component 2. First, the supporting parts 3 b of the pedestal3 are inserted into the through holes 7 a of the patch 7 to integratethe pedestal 3 and the patch 7. Next, the binding bands 6 are insertedinto the holes 3 c formed in the supporting parts 3 b of the pedestal 3.Thereafter, the case 1 of the electronic component 2 is mounted on thesupporting parts 3 b of the pedestal 3 and the binding bands are woundaround the case 1 and tied by use of binding parts 6 a. Thus, the case 1is fixed to the pedestal 3. In this event, a heat-insulating structureformed of a heat-insulating space 4 is formed between the case 1 and thebase plate part 3 a of the pedestal 3 (see FIGS. 3 to 5). Surplusportions of the binding bands 6 may be appropriately cut off. Moreover,a lining 8 may be laminated on a back side of the base plate part 3 a,in order to avoid direct contact between the pedestal 3 and an innersurface of the tire or the like.

Thereafter, as shown in FIGS. 3 to 5, the back side of the patch 7 isbonded to the installation position P. Thus, the installation structureof an electronic component for a tire can be formed, where the baseplate part 3 a of the pedestal 3 is attached to the installationposition P, the case 1 is fixed to the supporting parts 3 b of thepedestal 3, and the heat-insulating structure formed of theheat-insulating space 4 is interposed between the case 1 and the baseplate part 3 a of the pedestal 3.

In the above-described installation structure of an electronic componentfor a tire, the heat-insulating structure is interposed between theelectronic component 2, which is installed in the air chamber of thetire, and the installation position P. Thus, the electronic component 2is protected from the heat produced by the tire and the braking device.At the same time, more accurate information about the inside of the tirecan be obtained without being affected by the heat sources as describedabove. Consequently, an inexpensive component can be used as theelectronic component 2, and life of the electronic component 2 can beextended. Moreover, while a temperature in the air chamber of the tireand an internal pressure of the tire are cited as the information aboutthe inside of the tire, the accurate temperature can be obtained bypreventing the electronic component from being affected by the heatsources as described above, and at the same time, it becomes possible toobtain a highly accurate cold air pressure calculated by an operationusing the internal pressure of the tire, which is corrected based on thetemperature.

Furthermore, in the embodiment described above, the case 1 of theelectronic component 2 is fixed to the pedestal 3 by use of the bindingbands 6. Thus, if there arises a problem with the electronic component2, the electronic component 2 can be easily replaced by cutting off thebinding bands 6.

However, means for fixing the case of the electronic component to thepedestal is not particularly limited. For example, engaging parts may beprovided respectively on the pedestal and on the case, and the case maybe fitted into the pedestal in a state where the engaging parts areengaged with each other. Moreover, when the case is fixed to thepedestal, a fastening structure by use of screws may be adopted.

The embodiment described above is suitable particularly for the casewhere the electronic component is installed on an inner surface of apneumatic tire. When the electronic component housed in the case isinstalled on an outer peripheral surface of a rim of a wheel, a ringmember capable of fastening, for example, is used instead of the patch.Accordingly, the pedestal may be attached to the outer peripheralsurface of the rim by use of the ring member.

INDUSTRIAL APPLICABILITY

According to the present invention, in the structure where theelectronic component housed in the case is installed at any installationposition in the air chamber of the tire, the heat-insulating structureis interposed between the electronic component and the installationposition. Thus, the electronic component is protected from the heatproduced by the tire and the braking device. At the same time, moreaccurate information about the inside of the tire can be obtainedwithout being affected by the heat sources. Moreover, if there arises aproblem with the electronic component, the electronic component can beeasily replaced by use of a detachable pedestal which supports the caseof the electronic component.

Although the embodiment of the present invention has been described indetail above, it should be understood that various changes,alternatives, and substitutions can be made without departing from thespirit and scope of the present invention, which are defined by theattached claims.

1. An installation structure of an electronic component for a tire, where the electronic component housed in a case is installed at an arbitrary installation position in an air chamber of the tire, characterized in that a heat-insulating structure is interposed between the electronic component and the installation position.
 2. An installation structure of an electronic component for a tire, where an electronic component housed in a case is installed at an arbitrary installation position in an air chamber of the tire, characterized in that a heat-insulating structure is interposed between the case and the installation position.
 3. An installation structure of an electronic component for a tire, where an electronic component housed in a case is installed at an arbitrary installation position in an air chamber of the tire, characterized in: that a pedestal including a base plate part which comes into contact with the installation position, and supporting parts which support the case is used; that the base plate part of the pedestal is attached to the installation position; that the case is fixed to the supporting parts of the pedestal; and that a heat-insulating structure is interposed between the case and the base plate part of the pedestal.
 4. The installation structure of an electronic component for a tire according to any of claims 1 to 3, wherein a heat-insulating space is interposed as the heat-insulating structure.
 5. The installation structure of an electronic component for a tire according to any of claims 1 to 3, wherein a heat-insulating material is interposed as the heat-insulating structure.
 6. The installation structure of an electronic component for a tire according to claim 5, wherein the heat-insulating material is formed of any of resin foam, organic fibers and inorganic fibers.
 7. The installation structure of an electronic component for a tire according to claim 3, wherein the pedestal is formed of resin of which continuous duty is allowed at temperatures of no less than 80° C.
 8. The installation structure of an electronic component for a tire according to claim 3, wherein a patch which can be bonded to the installation position is integrated with the pedestal.
 9. The installation structure of an electronic component for a tire according to claim 8, wherein through holes are provided in the patch at positions corresponding to the supporting parts of the pedestal, and the pedestal is held by the patch while inserting the supporting parts into the through holes. 